Based on aggregated insights from structured factory profiles within the CNFX directory, the standard Precision LED Chip Carrier used in the Manufacture of Lighting Equipment sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.
A canonical Precision LED Chip Carrier is characterized by the integration of Ceramic Substrate and Conductive Trace. In industrial production environments, manufacturers listed on CNFX commonly emphasize Aluminum Nitride (AlN) Ceramic construction to support stable, high-cycle operation across diverse manufacturing scenarios.
Mechanical substrate for mounting and thermally managing individual LED semiconductor dies
Technical details and manufacturing context for Precision LED Chip Carrier
Commonly used trade names and technical identifiers for Precision LED Chip Carrier.
| pressure: | Atmospheric to 1.5 MPa (for hermetic sealing applications) |
| temperature: | -40°C to +150°C (operating), up to +300°C (peak during soldering) |
| flatness tolerance: | ≤10 μm across mounting surface |
| thermal resistance: | 0.5-5 K/W (junction-to-case, depending on design) |
Manufacturer profiles with relevant production capability in China
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Aluminum Nitride ceramic offers excellent thermal conductivity (typically 150-200 W/m·K), closely matched coefficient of thermal expansion to LED semiconductor materials, and superior electrical insulation, making it ideal for high-power LED applications requiring efficient heat dissipation.
CMC composite provides exceptional thermal conductivity while maintaining a coefficient of thermal expansion that closely matches LED semiconductor materials, preventing thermal stress and ensuring reliable performance in demanding lighting applications with high operating temperatures.
Key specifications include thermal conductivity (W/m·K) for heat dissipation, coefficient of thermal expansion (ppm/K) for material compatibility, die shear strength (MPa) for mechanical reliability, maximum operating temperature (°C), surface flatness (µm) for proper die attachment, and trace resistance (mΩ) for electrical performance.
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