Structured Manufacturing Data (2026)

Receiver/Detector Module

Based on aggregated insights from structured factory profiles within the CNFX directory, the standard Receiver/Detector Module used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Receiver/Detector Module is characterized by the integration of Photodetector Array and Signal Conditioning Circuit. In industrial production environments, manufacturers listed on CNFX commonly emphasize Silicon (for photodiodes/sensors) construction to support stable, high-cycle operation across diverse manufacturing scenarios.

A critical electronic component within an alignment sensor system that receives and detects signals for position measurement.

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Product Specifications

Technical details and manufacturing context for Receiver/Detector Module

Definition
The Receiver/Detector Module is an essential sub-assembly of an Alignment Sensor system, responsible for capturing optical, electromagnetic, or other signals emitted by a transmitter or target. It converts these signals into electrical data that the sensor's processing unit uses to determine precise position, alignment, or displacement measurements. Its performance directly impacts the sensor's accuracy, resolution, and reliability.
Working Principle
The module typically consists of a photodiode array, CCD/CMOS sensor, or other transducer elements. It receives incoming signals (e.g., laser beams, infrared light). These signals are converted into analog electrical currents, which are then amplified, filtered, and digitized by onboard circuitry. The resulting digital data is processed to identify the signal's centroid, intensity, or pattern, enabling precise calculation of the target's position relative to the sensor.
Common Materials
Silicon (for photodiodes/sensors), Printed Circuit Board (PCB), Aluminum alloy (housing)
Technical Parameters
  • Active detection area dimensions (e.g., 10x10 mm) (mm) Per Request
Components / BOM
  • Photodetector Array
    Converts incoming optical signals into electrical charge
    Material: Silicon
  • Signal Conditioning Circuit
    Amplifies and filters the raw electrical signal from the detector
    Material: PCB with electronic components
  • Protective Window Part
    Seals and protects the sensitive detector elements from dust and damage
    Material: Optical glass or sapphire
  • Module Housing Part
    Provides mechanical structure, shielding, and thermal management
    Material: Anodized aluminum

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Receiver/Detector Module.

alignment sensor receiver module photodetector array signal conditioning industrial position measurement detector PCB-based receiver module electronics protective window detector housing

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Alignment Sensor
View system integration details

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 1 bar (non-pressurized environment)
other spec: Signal frequency range: 400-800 MHz, Power supply: 12-24 VDC, IP rating: IP67
temperature: -40°C to +85°C
Media Compatibility
✓ Clean dry air ✓ Inert gases (e.g., nitrogen, argon) ✓ Non-conductive liquids (e.g., deionized water, dielectric oils)
Unsuitable: Conductive or corrosive media (e.g., saltwater, acids, metal slurries)
Sizing Data Required
  • Required measurement resolution (e.g., 0.1 mm)
  • Maximum measurement distance (e.g., 0-10 m)
  • Signal-to-noise ratio requirement (e.g., >20 dB)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Signal drift/attenuation
Cause: Degradation of internal optical components (e.g., lenses, mirrors) due to contamination, thermal cycling, or mechanical misalignment, leading to reduced sensitivity or inaccurate readings.
Electronic component failure
Cause: Thermal stress, voltage spikes, or moisture ingress damaging critical circuits (e.g., amplifiers, processors), resulting in complete loss of function or erratic output.
Maintenance Indicators
  • Intermittent or unstable output readings during calibration checks
  • Unusual audible humming, clicking, or complete silence from the module during operation (if it normally emits diagnostic sounds)
Engineering Tips
  • Implement regular preventive cleaning of optical surfaces using manufacturer-approved methods and materials to prevent contamination buildup.
  • Ensure stable environmental conditions (temperature, humidity) and use surge protection on power supplies to minimize thermal and electrical stress on electronic components.

Compliance & Manufacturing Standards

Reference Standards
ISO 9001:2015 Quality Management Systems IEC 61000-6-2 Electromagnetic Compatibility (EMC) CE Marking (EU Directive 2014/35/EU Low Voltage Directive)
Manufacturing Precision
  • Optical Alignment: +/-0.01°
  • Housing Dimensions: +/-0.05mm
Quality Inspection
  • Signal-to-Noise Ratio (SNR) Testing
  • Environmental Stress Screening (ESS) including thermal cycling and vibration testing

Factories Producing Receiver/Detector Module

Manufacturer profiles with relevant production capability in China

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Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What is the primary function of this receiver/detector module?

This module receives and detects optical or electronic signals within alignment sensor systems to enable precise position measurement in industrial applications.

What materials are used in the construction of this module?

The module utilizes silicon for photodiodes/sensors, a printed circuit board (PCB) for electronics, and aluminum alloy for the durable protective housing.

How does the signal conditioning circuit improve performance?

The signal conditioning circuit amplifies, filters, and processes raw signals from the photodetector array to ensure accurate, reliable position data with minimal noise interference.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

Data basis: CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks for Computer, Electronic and Optical Product Manufacturing.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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