Structured Manufacturing Data (2026)

Radar Sensor

Based on aggregated insights from structured factory profiles within the CNFX directory, the standard Radar Sensor used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Radar Sensor is characterized by the integration of Radio Frequency Integrated Circuit (RFIC/MMIC) and Antenna Array. In industrial production environments, manufacturers listed on CNFX commonly emphasize Printed Circuit Board (PCB) construction to support stable, high-cycle operation across diverse manufacturing scenarios.

An electronic device that uses radio waves to detect, locate, and measure the distance, speed, and direction of objects.

Product Specifications

Technical details and manufacturing context for Radar Sensor

Definition
A radar sensor is an electronic measurement device that operates by transmitting radio frequency electromagnetic waves and analyzing the reflected signals to determine the presence, range, velocity, and angle of objects within its detection field. It functions independently of light conditions and is capable of penetrating various non-metallic materials like fog, dust, and plastic, making it suitable for applications requiring reliable object detection in challenging environments.
Working Principle
The sensor operates on the principle of radar (Radio Detection and Ranging). It generates and emits a modulated radio frequency signal via a transmitter. When this signal encounters an object, a portion is reflected back towards the sensor. The receiver captures this echo. By analyzing the time delay between transmission and reception (Time of Flight), the distance to the object is calculated. The Doppler shift in the frequency of the returned signal is used to determine the object's radial velocity. Advanced signal processing techniques interpret the amplitude, phase, and frequency of the echo to provide detailed information about the target.
Common Materials
Printed Circuit Board (PCB), Semiconductor (MMIC), Antenna Element, Plastic/Polymer Housing, Metal Shielding
Technical Parameters
  • Maximum detection range of the sensor (meter) Per Request
Components / BOM
  • Radio Frequency Integrated Circuit (RFIC/MMIC)
    Generates the transmitted radio frequency signal and processes the received echo signal. It contains the oscillator, mixer, amplifier, and often an Analog-to-Digital Converter (ADC).
    Material: Semiconductor (Gallium Arsenide or Silicon Germanium)
  • Antenna Array
    Radiates the transmitted electromagnetic waves into space and collects the reflected waves from targets. Its design determines the beam shape and directivity.
    Material: Copper on PCB substrate or stamped metal
  • Digital Signal Processor (DSP)
    Executes algorithms (e.g., FFT, CFAR) on the digitized signal to extract target information like range, speed, and angle. It handles data processing and filtering.
    Material: Semiconductor (Silicon)
  • Power Management Unit
    Regulates and supplies stable DC voltage levels from the input power source to all other components within the sensor.
    Material: Semiconductor (Silicon) with passive components (capacitors, inductors)
  • Housing / Radome Part
    Provides mechanical protection, environmental sealing (IP rating), and electromagnetic shielding. The radome portion is transparent to RF signals.
    Material: Plastic (e.g., ABS, PBT) or metal alloy for shielding
  • Communication Interface Circuitry
    Provides the physical and protocol layer for the selected output interface (e.g., UART transceiver, CAN controller) to communicate with external systems.
    Material: Semiconductor (Silicon) and PCB traces

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Radar Sensor.

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 10 bar
other spec: Frequency: 24-80 GHz, Range: 0.1-100 m, Accuracy: ±1-5 mm
temperature: -40°C to +85°C
Media Compatibility
✓ Liquids in storage tanks ✓ Bulk solids in silos ✓ Process vessels with vapors
Unsuitable: High-viscosity or foaming media with signal attenuation
Sizing Data Required
  • Required measurement range (min-max distance)
  • Process connection size and mounting
  • Required accuracy and response time

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Signal attenuation or loss
Cause: Accumulation of contaminants (dust, moisture, ice, chemical deposits) on the antenna or lens, causing signal scattering or absorption; often due to inadequate environmental sealing or improper installation in harsh conditions.
Electronic component degradation
Cause: Thermal cycling or overheating leading to solder joint fatigue, capacitor aging, or integrated circuit failure; typically from poor ventilation, excessive ambient temperature, or power supply fluctuations.
Maintenance Indicators
  • Inconsistent or erratic measurement readings despite stable process conditions
  • Persistent communication errors or loss of signal indicated on the control system interface
Engineering Tips
  • Implement regular cleaning schedules for the sensor face using appropriate non-abrasive methods and compatible cleaning agents, ensuring seals remain intact to prevent contamination ingress.
  • Install thermal management measures such as heat sinks, sunshades, or enclosures with forced ventilation to maintain operating temperature within manufacturer specifications, and use regulated power supplies to minimize electrical stress.

Compliance & Manufacturing Standards

Reference Standards
ISO 9001:2015 - Quality Management Systems IEC 60945:2002 - Maritime Navigation and Radiocommunication Equipment and Systems EN 50121-3-2:2016 - Railway Applications - Electromagnetic Compatibility
Manufacturing Precision
  • Frequency Stability: +/- 0.001%
  • Beam Alignment: +/- 0.5 degrees
Quality Inspection
  • Environmental Stress Screening (ESS)
  • Radar Cross-Section (RCS) Measurement

Factories Producing Radar Sensor

Manufacturer profiles with relevant production capability in China

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What is the typical operating frequency range for this radar sensor?

This radar sensor operates in the GHz frequency range, optimized for precise object detection and measurement in computer and optical manufacturing environments.

How does the Digital Signal Processor (DSP) enhance this radar sensor's performance?

The integrated DSP processes radio wave data in real-time, improving accuracy in distance measurement, speed calculation, and object tracking while filtering environmental noise.

What materials ensure durability in industrial settings?

Constructed with a robust plastic/polymer housing, metal shielding for EMI protection, and high-quality PCB components, this sensor withstands manufacturing environments while maintaining precision.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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