Structured Manufacturing Data (2026)

Photodiode Array

Based on aggregated insights from structured factory profiles within the CNFX directory, the standard Photodiode Array used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Photodiode Array is characterized by the integration of Photodiode Element and Substrate. In industrial production environments, manufacturers listed on CNFX commonly emphasize Silicon (Si) construction to support stable, high-cycle operation across diverse manufacturing scenarios.

A linear or two-dimensional arrangement of multiple photodiodes integrated on a single semiconductor substrate for simultaneous detection of light intensity across multiple points.

View Full Specifications Explore Manufacturing Sources

Product Specifications

Technical details and manufacturing context for Photodiode Array

Definition
A photodiode array is a key component within a Position-Sensitive Detector (PSD) system. It consists of multiple discrete photodiode elements arranged in a precise pattern (typically linear or matrix). In a PSD, the array captures incident light, and by analyzing the signal distribution across the individual diodes, the system can determine the position, movement, or profile of a light spot or image falling on its surface with high spatial resolution.
Working Principle
Each photodiode in the array operates on the principle of the photoelectric effect in a semiconductor p-n junction. When photons strike the active area of a diode, they generate electron-hole pairs if their energy exceeds the semiconductor's bandgap. This creates a photocurrent proportional to the light intensity at that specific location. The array's readout circuitry (often multiplexed) sequentially or simultaneously measures the current from each diode, creating a spatial map of light intensity. In a PSD application, algorithms then process this intensity map to calculate the centroid or shape of the light distribution, translating it into precise positional data.
Common Materials
Silicon (Si), Germanium (Ge), Indium Gallium Arsenide (InGaAs)
Technical Parameters
  • Pixel pitch or center-to-center spacing between adjacent photodiodes in the array, critical for determining the spatial resolution of the PSD. (mm) Customizable
Components / BOM
  • Photodiode Element Part
    The fundamental light-sensing unit; a semiconductor p-n junction that converts photons into electrical current.
    Material: Silicon, Germanium, or III-V compound semiconductor
  • Substrate Part
    The base semiconductor wafer (e.g., silicon) on which the photodiode elements and associated circuitry are fabricated.
    Material: Silicon, Sapphire (for specialized applications)
  • Passivation Layer Part
    A protective dielectric layer (e.g., silicon dioxide, silicon nitride) deposited over the semiconductor surface to stabilize electrical properties and prevent contamination.
    Material: Silicon Dioxide (SiO₂), Silicon Nitride (Si₃N₄)
  • Metallization / Bonding Pads Part
    Conductive traces and contact pads (typically aluminum or gold) that provide electrical interconnection between the photodiode elements and the external readout circuitry.
    Material: Aluminum, Gold

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Photodiode Array.

silicon photodiode array detector InGaAs photodiode array spectroscopy linear photodiode array optical sensors multi-element photodiode array manufacturing photodiode array substrate passivation layer

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Position-Sensitive Detector
View system integration details
Flat Panel Detector
View system integration details
Camera Sensor (CMOS/CCD)
View system integration details
Read Head
View system integration details
Light Source/Detector (for optical encoders)
View system integration details
Light Source & Sensor (Optical Type)
View system integration details
Light Source/Detector
View system integration details

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: Atmospheric to 1 atm (standard packaging), vacuum compatible with special packaging
other spec: Wavelength range: 200-1100 nm (typical), Dark current: 0.1-100 nA, Response time: 1-100 ns
temperature: -40°C to +85°C (operational), -55°C to +125°C (storage)
Media Compatibility
✓ Visible light spectroscopy ✓ Laser beam profiling ✓ Optical character recognition systems
Unsuitable: High-energy radiation environments (X-ray, gamma ray)
Sizing Data Required
  • Required spectral response range (nm)
  • Number of pixels/elements needed
  • Required data acquisition rate (frames/sec)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Signal degradation
Cause: Photodiode dark current increase due to thermal aging or contamination ingress compromising optical surfaces
Array element failure
Cause: Electrostatic discharge (ESD) damage during handling or thermal cycling fatigue in solder joints
Maintenance Indicators
  • Increased noise or baseline drift in spectral data output
  • Visible condensation, particulate accumulation, or discoloration on optical window surfaces
Engineering Tips
  • Implement strict ESD protocols during installation/handling and maintain cleanroom conditions when possible
  • Ensure stable thermal environment with proper heat sinking and avoid rapid temperature cycling during operation

Compliance & Manufacturing Standards

Reference Standards
ISO 9001:2015 - Quality management systems IEC 60747-5-2 - Semiconductor devices - Discrete devices - Photodiodes CE marking - EU compliance for electromagnetic compatibility and safety
Manufacturing Precision
  • Spectral response uniformity: +/-5% across array
  • Dark current: <1nA per pixel at 25°C
Quality Inspection
  • Quantum efficiency measurement across wavelengths
  • Pixel-to-pixel crosstalk analysis

Factories Producing Photodiode Array

Manufacturer profiles with relevant production capability in China

Add your factory

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

Supply Chain Compatible Machinery & Devices

Industrial IoT Gateway

Edge computing device connecting industrial equipment to cloud platforms.

Explore Specs →
Modular Industrial Edge Computing Device

Rugged computing platform for industrial data processing at the network edge

Explore Specs →
Industrial Smart Camera Module

Embedded vision system for industrial automation and quality inspection.

Explore Specs →
Industrial Wireless Power Transfer Module

Wireless power transfer module for industrial equipment applications

Explore Specs →

Frequently Asked Questions

What are the main applications of photodiode arrays in computer and optical product manufacturing?

Photodiode arrays are essential for spectral analysis, imaging systems, optical character recognition, barcode scanning, and light measurement in various electronic and optical devices.

How does the choice of material (Si, Ge, or InGaAs) affect photodiode array performance?

Silicon arrays work best for visible light, Germanium for near-infrared, and InGaAs for extended infrared ranges. Material selection determines spectral response, sensitivity, and operating temperature range.

What factors should be considered when integrating photodiode arrays into electronic systems?

Key considerations include array geometry (linear vs. 2D), pixel pitch and uniformity, dark current, response time, spectral range matching, and proper interface with readout electronics through bonding pads.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

Data basis: CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks for Computer, Electronic and Optical Product Manufacturing.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Request Manufacturing Insight for Photodiode Array

Ask for use case, specification boundaries, supplier type, and RFQ preparation information for Photodiode Array.

Your business information is used only to process this request.

Thank you! Your message has been sent. We'll respond within 1–3 business days.
Thank you! Your message has been sent. We'll respond within 1–3 business days.

Need to Manufacture Photodiode Array?

Compare manufacturer profiles with relevant product and process capability.

Create Manufacturer Profile Contact Us
Previous Product
Photodetector/sensor
Next Product
Photodiode Receiver