Structured Manufacturing Data (2026)

Package

Based on aggregated insights from structured factory profiles within the CNFX directory, the standard Package used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Package is characterized by the integration of Leadframe / Substrate and Die Attach Pad. In industrial production environments, manufacturers listed on CNFX commonly emphasize Plastic (e.g., Epoxy Molding Compound) construction to support stable, high-cycle operation across diverse manufacturing scenarios.

The protective housing and electrical interface for a 3-axis gyroscope chip.

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Product Specifications

Technical details and manufacturing context for Package

Definition
In a 3-axis gyroscope, the package is the physical enclosure that protects the delicate MEMS (Micro-Electro-Mechanical Systems) sensor die from environmental factors such as moisture, dust, and mechanical stress. It provides the structural framework, electrical connections (typically via leads, pads, or a ball grid array), and often includes a hermetic seal to ensure long-term reliability and performance stability of the inertial measurement unit.
Working Principle
The package does not have an active working principle like a sensor element. Its function is passive: to physically contain the gyroscope die, provide a stable mechanical platform, facilitate electrical interconnection to the external circuit board, and shield the internal components from external environmental and electromagnetic interference.
Common Materials
Plastic (e.g., Epoxy Molding Compound), Ceramic (e.g., Alumina), Metal (e.g., Kovar alloy for lids)
Technical Parameters
  • Overall package dimensions (length x width x height), critical for PCB (Printed Circuit Board) footprint and assembly. (mm) Customizable
Components / BOM
  • Leadframe / Substrate Part
    Provides the structural base and electrical interconnect traces between the die and the external pins/pads.
    Material: Copper alloy
  • Die Attach Pad Part
    The area on the leadframe/substrate where the gyroscope sensor die is mounted and bonded.
    Material: Metal (often plated)
  • Wire Bonds / Solder Bumps Part
    Create electrical connections between the die's bond pads and the leadframe/substrate terminals.
    Material: Gold wire or Solder alloy
  • Molding Compound / Lid Part
    Forms the main protective body (plastic molding) or seals the cavity (ceramic/metal lid).
    Material: Epoxy resin or Ceramic/Metal

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Package.

Encapsulation Housing 3-axis gyroscope chip package protective housing for gyroscope sensors EMC epoxy molding compound packages Kovar alloy lid gyroscope packaging ceramic alumina substrate for MEMS devices

Applied To / Applications

This component is essential for the following industrial systems and equipment:

3-Axis Gyroscope
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Semiconductor Device
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Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 1 atm (non-pressurized)
other spec: Humidity: 0-95% RH non-condensing, Vibration: 20g max, Shock: 2000g max
temperature: -40°C to +85°C
Media Compatibility
✓ Clean dry air ✓ Inert gas environments ✓ Non-corrosive industrial atmospheres
Unsuitable: Direct liquid immersion or high-pressure washdown
Sizing Data Required
  • PCB footprint dimensions (mm)
  • Required connector type and pin count
  • Mounting method and clearance requirements

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Seal degradation
Cause: Chemical incompatibility between package seal materials and stored contents, leading to swelling, hardening, or cracking over time
Structural fatigue
Cause: Repeated mechanical stress from handling, stacking, or transportation causing material fatigue at stress concentration points like corners or seams
Maintenance Indicators
  • Visible bulging or deformation of package walls indicating pressure buildup or structural compromise
  • Audible hissing or whistling sounds suggesting seal failure and gas/fluid leakage
Engineering Tips
  • Implement material compatibility testing before selecting packaging for specific contents, considering chemical resistance, temperature tolerance, and mechanical properties
  • Use strain gauges or pressure sensors during transport simulations to identify and reinforce high-stress areas in package design

Compliance & Manufacturing Standards

Reference Standards
ISO 9001:2015 - Quality Management Systems ANSI/ASQ Z1.4-2008 - Sampling Procedures and Tables for Inspection by Attributes DIN 55350-12:1989 - Concepts of Quality Management and Statistics
Manufacturing Precision
  • Dimensional Stability: +/-0.5mm
  • Seal Integrity: Leak Rate < 0.01 cc/min
Quality Inspection
  • Visual Inspection for Surface Defects
  • Compression Test for Structural Integrity

Factories Producing Package

Manufacturer profiles with relevant production capability in China

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Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What materials are commonly used in 3-axis gyroscope chip packages?

Common materials include Epoxy Molding Compound (EMC) plastics for encapsulation, Alumina ceramics for substrates, and Kovar alloy metals for lids, providing thermal stability and protection.

How does the package protect the gyroscope chip?

The package provides mechanical protection from physical damage, shields against environmental factors like moisture and dust, and ensures proper electrical connectivity through wire bonds or solder bumps.

What are the key components in the BOM for this package?

Key components include the Die Attach Pad for chip mounting, Leadframe/Substrate for electrical connections, Molding Compound/Lid for encapsulation, and Wire Bonds/Solder Bumps for interconnections.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

Data basis: CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks for Computer, Electronic and Optical Product Manufacturing.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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