Structured Manufacturing Data (2026)

Network Interface Card (NIC)

Based on aggregated insights from structured factory profiles within the CNFX directory, the standard Network Interface Card (NIC) used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Network Interface Card (NIC) is characterized by the integration of Controller Chip and PHY (Physical Layer) Chip. In industrial production environments, manufacturers listed on CNFX commonly emphasize Silicon (for integrated circuits) construction to support stable, high-cycle operation across diverse manufacturing scenarios.

A hardware component that enables a database server to connect to a network and communicate with other devices.

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Product Specifications

Technical details and manufacturing context for Network Interface Card (NIC)

Definition
A Network Interface Card (NIC) is a critical hardware component installed in a database server, providing the physical interface for network connectivity. It translates data from the server into electrical signals suitable for transmission over network cables (e.g., Ethernet) or radio waves (for wireless NICs), and vice-versa for incoming data. Within a database server, the NIC facilitates client connections, data replication between servers, backup operations to network storage, and cluster communication, making it essential for data availability and distributed processing.
Working Principle
The NIC operates by receiving data packets from the server's CPU via the system bus (e.g., PCIe). Its controller chip processes these packets, adding necessary physical layer framing and error-checking data (like CRC). For wired Ethernet NICs, a PHY (physical layer) chip then converts the digital signals into analog signals for transmission over the twisted-pair cable. For reception, it reverses the process: it receives analog signals, converts them back to digital, checks for errors, strips the physical layer data, and passes the resulting data packets to the server's operating system via the bus.
Common Materials
Silicon (for integrated circuits), Fiberglass (for PCB substrate), Copper (for traces and connectors), Plastic (for housing)
Technical Parameters
  • The maximum data transfer rate supported by the NIC, such as 1 Gbps, 10 Gbps, 25 Gbps, or 100 Gbps. (Gbps) Per Request
Components / BOM
  • Controller Chip Part
    The main processor on the NIC that manages data packet handling, protocol offloading (e.g., TCP/IP), and communication with the server's bus.
    Material: silicon
  • PHY (Physical Layer) Chip
    Handles the analog signal modulation/demodulation for wired connections, implementing the electrical specifications of the Ethernet standard.
    Material: silicon
  • Connector (e.g., RJ45 Port) Part
    Provides the physical socket for inserting a network cable to establish a wired connection.
    Material: copper alloy, plastic
  • PCB (Printed Circuit Board) Part
    The base board that holds and electrically connects all other components of the NIC.
    Material: fiberglass, copper

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Network Interface Card (NIC).

database server network interface card industrial NIC for optical manufacturing high-speed network adapter for servers copper connector network interface card fiberglass PCB network adapter

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Database Server
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Telecommunications Equipment
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SCADA Server
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Network Switch/Router
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Management Node
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Storage Node
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Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (electronic component)
other spec: Humidity: 10% to 90% non-condensing, Power: 3.3V/5V/12V depending on slot type
temperature: 0°C to 70°C (operating), -40°C to 85°C (storage)
Media Compatibility
✓ Ethernet networks (copper/fiber) ✓ TCP/IP protocol stacks ✓ Virtualization environments (VMware/Hyper-V)
Unsuitable: High EMI/RFI industrial environments without shielding
Sizing Data Required
  • Network bandwidth requirement (1G/10G/25G/100G)
  • Server PCIe slot type and generation (PCIe 3.0/4.0/5.0)
  • Network topology and redundancy needs (single/dual port, teaming)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Thermal degradation
Cause: Overheating due to poor ventilation, dust accumulation, or excessive ambient temperature causing solder joint failure, component warping, or semiconductor breakdown.
Electrical overstress
Cause: Voltage spikes, electrostatic discharge (ESD), or power surges damaging sensitive microelectronics, often from improper handling, faulty power supplies, or inadequate grounding.
Maintenance Indicators
  • Intermittent or complete loss of network connectivity despite functional cables and switches
  • Abnormal heat emission from the NIC or adjacent motherboard area, often detectable by touch or thermal imaging
Engineering Tips
  • Implement regular cleaning of server/device internals to prevent dust buildup that impedes heat dissipation, using compressed air or anti-static vacuums.
  • Ensure proper grounding and use surge protectors or uninterruptible power supplies (UPS) to shield against electrical transients and maintain stable voltage.

Compliance & Manufacturing Standards

Reference Standards
ISO/IEC 11801: Information technology - Generic cabling for customer premises ANSI/TIA-568-C.2: Balanced Twisted-Pair Telecommunications Cabling and Components Standards CE Marking: Compliance with EU EMC Directive 2014/30/EU and Low Voltage Directive 2014/35/EU
Manufacturing Precision
  • Connector Pin Alignment: +/-0.1mm
  • PCB Trace Width/Spacing: +/-10% of nominal design value
Quality Inspection
  • Bit Error Rate Test (BERT) for signal integrity verification
  • Electromagnetic Compatibility (EMC) Testing for radiated/conducted emissions

Factories Producing Network Interface Card (NIC)

Manufacturer profiles with relevant production capability in China

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Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What makes this NIC suitable for database server applications?

This NIC features a dedicated controller chip optimized for high-throughput data transfer, low-latency communication, and reliable connectivity essential for database server operations in industrial environments.

How does the fiberglass PCB substrate enhance performance?

The fiberglass PCB provides superior thermal stability, electrical insulation, and mechanical durability, ensuring consistent signal integrity and long-term reliability in demanding manufacturing settings.

What network standards does this NIC support?

This NIC supports industry-standard protocols including Gigabit Ethernet (1000BASE-T), with compatibility for various network configurations commonly used in computer and optical product manufacturing facilities.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

Data basis: CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks for Computer, Electronic and Optical Product Manufacturing.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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