INDUSTRY COMPONENT

Target Layer

The target layer is the consumable material surface in sputtering systems that releases atoms for thin film deposition on substrates.

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Component Specifications

Definition
In physical vapor deposition (PVD) systems, the target layer is the precisely engineered material disc mounted in the cathode assembly that undergoes ion bombardment during sputtering. This controlled erosion releases atoms or molecules that travel through the vacuum chamber to deposit as thin films on substrates, enabling the creation of functional coatings in semiconductor, display, and optical applications.
Working Principle
When high-energy ions (typically argon) bombard the target surface in a vacuum environment, momentum transfer causes atoms from the target material to be ejected through physical collision. These ejected atoms travel through the chamber and condense on substrates, forming thin films with controlled thickness and composition.
Materials
High-purity metals (Al, Cu, Ti, Mo, W), alloys (Al-Cu, Ti-W), ceramics (ITO, SiO2, Al2O3), or compounds with purity levels typically 99.95%-99.999% (3N5-5N), depending on application requirements.
Technical Parameters
  • Purity 99.95%-99.999%
  • Bonding Brazed or diffusion-bonded to backing plate
  • Density ≥95% theoretical
  • Diameter 50-450 mm
  • Thickness 3-20 mm
  • Grain Size 10-100 μm
Standards
ISO 9001, ASTM F3091, SEMI Standards

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Target Layer.

sputtering target PVD target thin film deposition vacuum coating semiconductor manufacturing display technology physical vapor deposition Target Layer Target Layer in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Anode Disc/Target

The rotating disc-shaped target material in X-ray tubes that emits X-rays when bombarded by electrons.

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Engineering Analysis

Risks & Mitigation
  • Arcing causing film defects
  • Thermal cracking from poor cooling
  • Non-uniform erosion reducing utilization
  • Contamination from impurities
FMEA Triads
Trigger: Insufficient cooling or bonding defects
Failure: Thermal stress cracking
Mitigation: Implement thermal monitoring, ensure proper bonding quality control, and optimize cooling design
Trigger: Material impurities or microstructure defects
Failure: Particle generation and film contamination
Mitigation: Enhance material purification processes, implement strict quality inspection, and control grain structure

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
Diameter: ±0.5 mm, Thickness: ±0.1 mm, Flatness: ≤0.05 mm, Surface roughness: Ra ≤0.8 μm
Test Method
Ultrasonic testing for bonding integrity, EDX for composition analysis, metallographic examination for microstructure

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What determines target layer lifespan?

Lifespan depends on material properties, sputtering power, erosion uniformity, and cooling efficiency. Typical targets achieve 80-90% utilization before replacement.

How are target layers bonded to backing plates?

Through brazing with high-conductivity alloys or diffusion bonding under heat and pressure to ensure optimal thermal transfer and mechanical stability.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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Target disc Temperature Compensation Circuit