INDUSTRY COMPONENT

Substrate/Disc Body

Substrate/Disc Body is the foundational component in anode disc/target assemblies for physical vapor deposition (PVD) systems, providing structural support and thermal management.

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Component Specifications

Definition
The Substrate/Disc Body is a precision-engineered metallic component that serves as the backbone of anode disc/target assemblies in PVD coating systems. It functions as the mounting platform for sputtering target materials (typically metals or ceramics) and ensures efficient heat dissipation during high-power deposition processes. This component maintains dimensional stability under thermal cycling and mechanical stress while providing reliable electrical connectivity.
Working Principle
The Substrate/Disc Body operates on principles of thermal conduction and mechanical support. During sputtering, it transfers heat away from the target material through its engineered geometry and material properties, preventing thermal runaway. Its flat surface ensures uniform target material bonding, while its structural integrity maintains vacuum seal compatibility in the deposition chamber.
Materials
High-purity oxygen-free copper (C10100/C10200), aluminum alloys (6061-T6), or stainless steel (316L) with thermal conductivity >200 W/m·K. Copper variants often include diffusion-bonded backing plates for enhanced bonding.
Technical Parameters
  • Diameter 100-500 mm
  • Flatness <0.05 mm
  • Thickness 10-50 mm
  • Surface Roughness Ra < 0.8 μm
  • Thermal Conductivity >200 W/m·K
  • Water Cooling Channels Standard (for high-power applications)
  • Maximum Operating Temperature 300°C
Standards
ISO 9001, ASTM B152, SEMI F47

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Substrate/Disc Body.

sputtering target substrate anode disc body PVD component thermal management disc target backing plate vacuum deposition part Substrate/Disc Body Substrate/Disc Body in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Anode Disc/Target

The rotating disc-shaped target material in X-ray tubes that emits X-rays when bombarded by electrons.

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Engineering Analysis

Risks & Mitigation
  • Thermal stress cracking
  • Target material delamination
  • Cooling channel corrosion
  • Electrical arcing at interfaces
FMEA Triads
Trigger: Insufficient cooling flow
Failure: Target overheating and premature failure
Mitigation: Implement flow sensors and thermal monitoring with automatic shutdown protocols
Trigger: Poor surface preparation
Failure: Target material bonding failure
Mitigation: Standardize surface cleaning procedures and implement bond strength testing
Trigger: Material impurities
Failure: Reduced thermal conductivity and outgassing
Mitigation: Source materials from certified suppliers with material traceability

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±0.1 mm dimensional, ±0.05° flatness
Test Method
Helium leak testing (<1×10⁻⁹ mbar·L/s), thermal cycling (100 cycles), ultrasonic bond testing

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What is the primary function of the Substrate/Disc Body?

It provides structural support for the sputtering target material and efficiently dissipates heat generated during the PVD process to prevent target degradation.

Why is copper commonly used for this component?

Copper offers excellent thermal conductivity (>400 W/m·K) and good machinability, making it ideal for heat dissipation in high-power sputtering applications.

How does this component affect coating quality?

Proper thermal management through the Substrate/Disc Body ensures consistent target erosion rates, leading to uniform film thickness and improved coating adhesion.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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