INDUSTRY COMPONENT

Package Pins

Package pins are conductive terminals on integrated circuits that provide electrical connections between the chip and external circuits.

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Component Specifications

Definition
Package pins are metallic leads or terminals extending from the housing of an integrated circuit or semiconductor device, designed to establish reliable electrical connections through soldering or insertion into sockets. In line driver/receiver applications, these pins transmit differential signals, power, ground, and control signals while ensuring signal integrity and mechanical stability.
Working Principle
Package pins function as electrical conduits by conducting signals and power between the semiconductor die inside the package and the printed circuit board. They maintain impedance matching, minimize signal loss through proper material conductivity, and provide mechanical attachment through solder joints or contact pressure.
Materials
Copper alloy (typically C19400 or C70250) with nickel/gold plating (ENIG or electrolytic gold over nickel) for corrosion resistance and solderability. Lead-free finishes comply with RoHS standards.
Technical Parameters
  • Pitch 0.5mm-2.54mm
  • Pin Count 8-64 pins
  • Solderability Meets IPC-J-STD-002
  • Current Rating 1A-3A per pin
  • Voltage Rating 50V-250V
  • Plating Thickness Gold: 0.05-0.25μm, Nickel: 2-5μm
  • Contact Resistance <20mΩ
  • Insulation Resistance >1000MΩ
  • Operating Temperature -40°C to +125°C
Standards
ISO 9001, IPC-7351, JEDEC MO-153, IEC 60748

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Package Pins.

package pins IC pins semiconductor leads line driver pins electronic connectors solder terminals PCB components signal integrity Package Pins in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Line Driver/Receiver

Electronic component that transmits and receives signals over communication lines

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RF/IR Transmitter IC

An integrated circuit designed to generate and modulate RF or infrared signals for wireless transmission.

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Engineering Analysis

Risks & Mitigation
  • Solder joint fatigue under thermal cycling
  • Corrosion in humid environments
  • Mechanical damage during assembly
  • Signal degradation at high frequencies
FMEA Triads
Trigger: Thermal expansion mismatch between pin material and PCB
Failure: Solder joint cracking leading to intermittent or open connections
Mitigation: Use compliant pin designs, optimize solder alloy, implement strain relief in PCB layout
Trigger: Insufficient plating thickness or contamination
Failure: Poor solderability and increased contact resistance
Mitigation: Implement strict plating quality control, use ENIG or immersion gold finishes, follow IPC plating standards

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
Pin position tolerance ±0.1mm, plating thickness tolerance ±10%
Test Method
Visual inspection per IPC-A-610, solderability testing per J-STD-002, electrical continuity testing, thermal cycling per JESD22-A104

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Serial Interface
Serial interface for industrial data transmission between IoT gateways and legacy equipment using RS-232/422/485 protocols.

Frequently Asked Questions

What are the common failure modes of package pins?

Common failures include solder joint cracks due to thermal cycling, corrosion from environmental exposure, mechanical bending or breakage during handling, and plating degradation leading to poor connectivity.

How do package pins affect signal integrity in high-speed applications?

Package pins introduce parasitic inductance and capacitance that can cause signal reflection, attenuation, and crosstalk. Proper pin design with controlled impedance and short lengths is critical for maintaining signal integrity in high-speed line driver/receiver circuits.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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