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Molybdenum Core/Base Component – Computer, Electronic and Optical Product Manufacturing

Component Specifications

Definition

The molybdenum core/base serves as the foundational structural element in tungsten-rhenium target disks, providing mechanical support, thermal management, and electrical conductivity. This component is specifically engineered to withstand extreme thermal cycling (up to 2500°C) and high rotational speeds (typically 3000-10000 RPM) while maintaining dimensional stability and preventing thermal expansion mismatch with the tungsten-rhenium alloy target surface.

Working Principle

The molybdenum core/base operates on principles of thermal conductivity, structural integrity, and rotational stability. It efficiently transfers heat away from the tungsten-rhenium focal spot through its high thermal conductivity (138 W/m·K at 20°C), while providing a rigid mounting platform that maintains precise focal spot positioning during high-speed rotation. The component's low thermal expansion coefficient (4.8×10⁻⁶/K at 20°C) minimizes thermal stress at the interface with the tungsten-rhenium layer.

Materials

High-purity molybdenum (Mo ≥ 99.95%), typically alloyed with small amounts of lanthanum oxide (La₂O₃ ≤ 0.5%) for improved high-temperature strength and recrystallization resistance. Material must meet ASTM B387 specifications for molybdenum and molybdenum alloy plate, sheet, and foil.

Technical Parameters

Density 10.22 g/cm³
Diameter 50-200 mm
Flatness ≤ 0.025 mm
Thickness 5-25 mm
Parallelism ≤ 0.01 mm
Surface Finish Ra ≤ 0.8 μm
Thermal Conductivity ≥ 130 W/m·K at 100°C
Electrical Resistivity 5.2 μΩ·cm at 20°C
Maximum Operating Temperature 2500°C

Standards

ISO 9001, ISO 13485, ASTM B387, DIN 17465

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Molybdenum Core/Base.

Parent Products

This component is used in the following industrial products

Tungsten-Rhenium Target Disk

A specialized rotating disk within medical X-ray tube anode assemblies that generates X-rays through electron bombardment.

View Product Details

Engineering Analysis

Risks & Mitigation

Thermal fatigue failure
Creep deformation at high temperatures
Interface delamination
Microcrack propagation
Oxidation at elevated temperatures in non-vacuum environments

FMEA Triads

Trigger: Repeated thermal cycling between room temperature and 2500°C
Failure: Thermal fatigue cracks initiating at stress concentration points
Mitigation: Implement optimized fillet radii at transitions, use finite element analysis to minimize stress concentrations, apply surface compressive residual stresses through shot peening

Trigger: Sustained operation at temperatures above 2000°C
Failure: Creep deformation leading to dimensional instability and focal spot drift
Mitigation: Use lanthanum oxide-doped molybdenum for improved high-temperature strength, implement active cooling systems, establish maximum continuous operating temperature limits

Trigger: Thermal expansion mismatch between molybdenum and tungsten-rhenium
Failure: Interface delamination and bond failure
Mitigation: Design with graded transition layers, use diffusion bonding techniques, implement thermal barrier coatings, optimize operating temperature profiles

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance

Geometric tolerances per ISO 2768-mK, dimensional tolerances ±0.05 mm, surface roughness Ra ≤ 0.8 μm

Test Method

Ultrasonic testing for internal defects per ASTM E317, dimensional verification with CMM per ISO 10360, thermal cycling testing per IEC 60601-2-44, metallurgical analysis per ASTM E3

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation

4/5

Manufacturing capability

4/5

Inspection readiness

5/5

Supplier transparency

3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

Why is molybdenum used instead of other metals for the core/base?

Molybdenum offers an optimal combination of high melting point (2623°C), excellent thermal conductivity, low thermal expansion, and good mechanical strength at elevated temperatures, making it ideal for withstanding the extreme conditions in rotating anode X-ray tubes.

What are the main failure modes of molybdenum cores/bases?

Primary failure modes include thermal fatigue cracking due to repeated heating/cooling cycles, creep deformation under sustained high-temperature operation, and interface delamination from thermal expansion mismatch with the tungsten-rhenium layer.

How does the molybdenum core/base affect X-ray tube performance?

The core/base directly impacts focal spot stability, heat dissipation efficiency, and tube lifespan. Proper design ensures minimal thermal drift, efficient heat transfer to cooling systems, and reliable operation under continuous high-power conditions.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Molybdenum Core/Base