INDUSTRY COMPONENT

Microvia

Microvia is a small laser-drilled hole in HDI PCBs for high-density interconnections between layers.

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Component Specifications

Definition
A microvia is a type of via with a diameter typically less than 150 microns, created using laser drilling technology in High-Density Interconnect (HDI) printed circuit boards. It enables vertical electrical connections between adjacent layers in multilayer PCBs, allowing for higher component density, reduced signal path lengths, and improved electrical performance in compact electronic devices.
Working Principle
Microvias work by creating conductive pathways between PCB layers through laser ablation of dielectric material, followed by metallization (usually copper plating) to establish electrical continuity. They use sequential build-up technology where layers are added and interconnected progressively, unlike traditional through-hole vias that penetrate the entire board thickness.
Materials
Dielectric materials: FR-4, polyimide, BT epoxy, or specialized HDI laminates. Conductive material: Electroless copper plating followed by electrolytic copper plating. Surface finish: ENIG (Electroless Nickel Immersion Gold), immersion silver, or OSP (Organic Solderability Preservative).
Technical Parameters
  • Diameter 50-150 μm
  • Layer Count Up to 20+ layers
  • Aspect Ratio 0.75:1 to 1:1
  • Drilling Method UV or CO2 laser
  • Plating Thickness 15-25 μm
  • Registration Accuracy ±15 μm
Standards
IPC-6012, IPC-2226, J-STD-001, ISO 9001

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Microvia.

microvia HDI PCB laser drilling high-density interconnect PCB technology multilayer PCB via technology Microvia in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

HDI PCB

A printed circuit board with high wiring density per unit area, featuring microvias, fine lines, and multiple sequential lamination layers.

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Engineering Analysis

Risks & Mitigation
  • Thermal stress cracking
  • Plating voids
  • Registration inaccuracies
  • Signal integrity issues
  • Manufacturing yield variations
FMEA Triads
Trigger: Insufficient copper plating
Failure: Open circuit or high resistance
Mitigation: Optimize plating parameters and implement automated optical inspection
Trigger: Thermal expansion mismatch
Failure: Barrel cracking during thermal cycling
Mitigation: Use compatible materials with matched CTE and implement thermal stress testing
Trigger: Laser drilling misalignment
Failure: Poor interconnection or short circuits
Mitigation: Implement precision registration systems and statistical process control

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±15 μm positional accuracy, ±10 μm diameter tolerance
Test Method
Cross-section analysis, electrical continuity testing, thermal cycling (IPC-TM-650), microsection evaluation

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What is the difference between microvia and through-hole via?

Microvias are laser-drilled and connect only adjacent layers with diameters under 150μm, while through-hole vias are mechanically drilled through the entire board with larger diameters and connect all layers.

What are the advantages of using microvias?

Microvias enable higher component density, shorter signal paths, better electrical performance, reduced layer count, and smaller form factors in electronic devices.

What are the common failure modes of microvias?

Common failures include plating voids, cracks due to thermal stress, registration errors, and copper barrel fractures during thermal cycling.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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Microstructure Pattern Mirror Substrate