INDUSTRY COMPONENT

Lead Frame

A lead frame is a metal structure inside semiconductor packages that provides electrical connections between the chip and external circuitry.

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Component Specifications

Definition
A lead frame is a critical component in semiconductor packaging that serves as the mechanical support for the semiconductor die and provides the electrical pathways connecting the integrated circuit to external circuits. In photocoupler assembly, it specifically supports the LED and photodetector chips while creating isolated electrical connections between input and output sides.
Working Principle
The lead frame functions by providing a conductive path from the semiconductor die to external pins while maintaining structural integrity. In photocouplers, it enables electrical isolation between input and output circuits by physically separating the LED and photodetector sections while allowing optical coupling through transparent encapsulation.
Materials
Copper alloy (C194, C7025) or iron-nickel alloy (Alloy 42) with silver or gold plating; thickness typically 0.15-0.25mm
Technical Parameters
  • CTE 5-18 ppm/°C
  • Pitch 1.27mm, 2.54mm
  • Lead Count 4-16 pins
  • Package Type DIP, SOP, SSOP
  • Isolation Voltage 2500V-5000V
  • Thermal Conductivity 200-400 W/m·K
Standards
ISO 9001, JEDEC MS-001, IEC 60747-5

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Lead Frame.

lead frame semiconductor packaging photocoupler component electronic packaging IC lead frame chip carrier Lead Frame in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Photocoupler Assembly

A complete assembly containing the core photocoupler device and its supporting electrical/mechanical elements, designed for integration into an isolation barrier system.

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Optical Coupler

An electronic component that transfers electrical signals between two isolated circuits using light waves.

View Product Details

Light Emitting Unit

The core light-producing component within warning light systems that generates visible illumination for signaling purposes.

View Product Details

Engineering Analysis

Risks & Mitigation
  • Thermal stress cracking
  • Corrosion in humid environments
  • Lead frame deformation during assembly
  • Electrical short circuits
  • Poor wire bonding quality
FMEA Triads
Trigger: Thermal expansion mismatch between lead frame and molding compound
Failure: Package cracking or delamination
Mitigation: Use lead frame materials with CTE matching the molding compound; implement stress-relief designs
Trigger: Contamination on bonding surfaces
Failure: Poor wire bond adhesion leading to open circuits
Mitigation: Implement strict cleaning processes; use protective plating; maintain cleanroom assembly conditions

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±0.05mm dimensional tolerance, ±0.01mm flatness
Test Method
Visual inspection, dimensional measurement, pull test for wire bonds, isolation voltage test, thermal cycling test

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What is the primary function of a lead frame in photocouplers?

The lead frame provides electrical connections to the LED and photodetector chips while maintaining complete electrical isolation between input and output circuits, which is essential for photocoupler safety and functionality.

Why are copper alloys commonly used for lead frames?

Copper alloys offer excellent electrical conductivity, good thermal dissipation, mechanical strength, and cost-effectiveness, making them ideal for most lead frame applications.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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