INDUSTRY COMPONENT

Infrared LED Die

Infrared LED die is a semiconductor light-emitting component that emits infrared radiation when electrically activated, used for optical isolation and signal transmission in photocouplers.

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Component Specifications

Definition
An infrared LED die is a miniature semiconductor device fabricated from gallium arsenide (GaAs) or aluminum gallium arsenide (AlGaAs) materials, designed to emit electromagnetic radiation in the infrared spectrum (typically 850-950 nm wavelength) when forward-biased. As the core light source in photocoupler assemblies, it converts electrical signals into optical signals that traverse an isolation barrier to activate a photodetector, enabling galvanic isolation between circuits.
Working Principle
Operates on electroluminescence principle: when forward voltage is applied across the p-n junction, electrons and holes recombine in the active region, releasing energy as photons in the infrared spectrum. The emitted IR light intensity is directly proportional to the forward current.
Materials
Gallium Arsenide (GaAs) or Aluminum Gallium Arsenide (AlGaAs) epitaxial layers on substrate, with gold or aluminum bonding wires, encapsulated in transparent silicone or epoxy for optical transmission.
Technical Parameters
  • Wavelength 850-950 nm
  • Viewing Angle 15-30 degrees
  • Rise/Fall Time 10-100 ns
  • Forward Current 20-100 mA
  • Forward Voltage 1.2-1.6V
  • Radiant Intensity 10-100 mW/sr
Standards
ISO 9001, IEC 60747-5-2, JEDEC JESD22

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Infrared LED Die.

infrared LED die IR LED chip photocoupler component optoelectronic semiconductor GaAs LED optical isolation signal transmission industrial electronics Infrared LED Die in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Photocoupler Assembly

A complete assembly containing the core photocoupler device and its supporting electrical/mechanical elements, designed for integration into an isolation barrier system.

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Engineering Analysis

Risks & Mitigation
  • Electrostatic discharge damage during handling
  • Thermal degradation from excessive current
  • Delamination of encapsulation materials
  • Wavelength drift over temperature cycles
FMEA Triads
Trigger: Excessive forward current beyond specifications
Failure: Thermal runaway leading to catastrophic failure
Mitigation: Implement current-limiting circuits and thermal management in driver design
Trigger: Electrostatic discharge during assembly
Failure: Latent or immediate junction damage reducing output
Mitigation: ESD-protected workstations and proper handling procedures

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±5% wavelength variation, ±10% radiant intensity
Test Method
IEC 60747-5-2 for optoelectronic devices, including spectral distribution, forward voltage, and radiant intensity measurements under controlled conditions

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What is the primary function of an infrared LED die in photocouplers?

The infrared LED die serves as the light source that converts electrical input signals into infrared optical signals, which then cross an isolation gap to activate a photodetector, providing electrical isolation between circuits while transmitting signals.

Why are infrared wavelengths preferred over visible light in photocouplers?

Infrared wavelengths (850-950 nm) are used because silicon photodetectors have peak sensitivity in this range, resulting in higher efficiency. Additionally, IR light is invisible, reduces interference from ambient light, and allows for better material compatibility with encapsulation compounds.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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