Epoxy fill is a thermosetting polymer compound used for encapsulating, insulating, and protecting sensitive electronic components within sensing probes and heads.
Commonly used trade names and technical identifiers for Epoxy Fill.
This component is used in the following industrial products
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It protects internal electronics from environmental factors like moisture, chemicals, and mechanical stress, ensuring accurate and reliable sensor operation.
It's mixed as a two-part system, dispensed into the probe housing around components, and cured at room or elevated temperature to form a solid barrier.
Once cured, it's generally irreversible; repair requires destructive removal and reapplication, so design should consider serviceability.
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