INDUSTRY COMPONENT

Array Housing

Protective housing for pattern sensor arrays in industrial automation systems

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Component Specifications

Definition
A precision-engineered enclosure designed to protect and structurally support pattern sensor arrays in industrial automation applications. It provides environmental sealing, electromagnetic shielding, thermal management, and precise alignment for optical or electronic sensors used in quality control, inspection, and measurement systems.
Working Principle
The housing maintains optimal operating conditions for pattern sensors by providing physical protection from contaminants, mechanical stability to prevent misalignment, thermal regulation to prevent sensor drift, and electromagnetic shielding to prevent interference with sensitive sensor signals.
Materials
Aluminum alloy 6061-T6 with hard anodized coating (15-20μm), optional stainless steel 316L for corrosive environments, internal components may include copper-nickel alloy for EMI shielding and thermal interface materials for heat dissipation
Technical Parameters
  • Weight 0.8-2.5kg depending on size
  • Mounting Standard VESA or custom flange patterns
  • IP Rating IP67 minimum
  • Dimensions Customizable (typical: 200x150x50mm)
  • Cable Entry M12 or M23 connectors with strain relief
  • EMI Shielding ≥40dB at 1GHz
  • Thermal Conductivity ≥150 W/m·K
  • Operating Temperature -20°C to +85°C
Standards
ISO 13849-1, IEC 60529, ISO 12100, DIN EN 61326-1

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Array Housing.

sensor array housing pattern sensor enclosure industrial sensor protection EMI shielded housing IP67 sensor housing thermal management enclosure automation component Array Housing Array Housing in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Pattern Sensor Array

A multi-sensor component that detects and captures pattern data for processing systems.

View Product Details

ANC Microphone Array

A multi-microphone system integrated into headphones that captures ambient sound for active noise cancellation processing.

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Contact Array

A structured arrangement of electrical contact points within a test fixture interface.

View Product Details

Engineering Analysis

Risks & Mitigation
  • Thermal expansion causing misalignment
  • EMI interference affecting sensor accuracy
  • Mechanical vibration leading to fatigue failure
  • Corrosion in harsh environments
FMEA Triads
Trigger: Inadequate thermal management
Failure: Sensor drift and measurement inaccuracy
Mitigation: Implement active cooling or improved heat sink design
Trigger: Vibration-induced fatigue
Failure: Structural failure and sensor misalignment
Mitigation: Use vibration-damping mounts and reinforced structural design
Trigger: EMI/RFI interference
Failure: Signal corruption and false readings
Mitigation: Implement multi-layer shielding and proper grounding

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±0.05mm for critical mounting surfaces, ±0.1mm for overall dimensions
Test Method
Coordinate Measuring Machine (CMM) verification, environmental chamber testing, EMI/RFI shielding effectiveness testing per MIL-STD-461

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

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Frequently Asked Questions

What environmental protection does array housing provide?

Array housing typically provides IP67 protection against dust and water ingress, with optional higher ratings available for harsh environments.

Can array housing be customized for different sensor configurations?

Yes, array housing can be custom-designed to accommodate specific sensor layouts, cable routing requirements, and mounting configurations.

How does array housing manage heat from sensors?

Through integrated heat sinks, thermal interface materials, and optimized airflow design to maintain sensors within specified temperature ranges.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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